All Issue

2021 Vol.41, Issue 2 Preview Page


April 2021. pp. 63-71
BP P.L.C., Statistical Review of World Energy, Statistical Review of Wolrd Energy 2020 69th edition, Statistical Review of World Energy, 2019.
Song, J. H., Jee, H. S., Moon, D. H., Kim, D. H., Yang, O. B., and Jeong, C. H., Improvement in Power of Shingled Strings by Re-work Process, KPVS, Vol. 7, No. 2, pp. 51-54, 2019.
Theunissen, L., Willems, B., Burke, J., Tonini, D., Galiazzo, M., and Henkens, A., Electrically Conductive Adhesives as Cell Interconnection Material in Shingled Module Technology, AIP Conference Proceedings, Vol. 1999, pp. 080003-1-080003-6, 2018. 10.1063/1.5049305
Schulte-Huxel, H., Blankemeyer, S., Morlier, A., Brendel, R., and Köntges, M., Interconnect-shingling: Maximizing the Active Module Area with Conventional Module Processes, Solar Energy Materials and Solar Cells, Vol. 200, p.109991, 2019.
Chowdhury, S., Cho, E. C., Cho, Y. H., Kim, Y. K., and Yi, J. S., Analysis of Cell to Module Loss Factor for Shingled PV Module, New & Renewable Energy, Vol. 9, No. 3, pp. 1-12, 2020. 10.7849/ksnre.2020.0009
Tonini, D., Cellere, G., Bertazzo, M., Fecchio, A., Cerasti, L., and Galiazzo, M., Shingling Technology for Cell Interconnection: Technological Aspects And Process Intergration, Energy Procedia, pp. 36-43, 2018. 10.1016/j.egypro.2018.09.010
Cho, H. S., Lee, J. I., Park, S., Song, H., Shin, D.-Y., Kim, T., and Kang, M. G., Photovoltaic Modules Using a Galinstan Paste Interconnection, Journal of the Korean Physical Society, Vol. 74, No. 12, pp. 1184-1189, 2019. 10.3938/jkps.74.1184
Eiternick, S., Kaule, F., Zühlke, H.-U., Kießling, T., Grimm, M., Schoenfelder, S., and Turek, M., High Quality Half-cell Processing Using Thermal Laser Separation, Energy Procedia, Vol. 77, pp. 340-345, 2015. 10.1016/j.egypro.2015.07.048
Geipel, T., Meinert, M., Kraft, A., and Eitner, U., Optimization of Electrically Conductive Adhesive Bonds in Photovoltaic Modules, IEEE Journal of Photovoltaics, Vol. 8, No. 4, pp. 1074-1081, 2018. 10.1109/JPHOTOV.2018.2828829
Wang, X. Q., Gan, W. P., Xiang, F., and Li, B. Y., Effect of Curing Agent and Curing Substrate on Low Temperature Curable Silver Conductive Adhesive, Journal of Materials Science: Materials in Electronics, Vol. 30, No. 3, pp. 2829-2836, 2019. 10.1007/s10854-018-0559-y
Lim, J. R., Shin, W. G., Hwang, H. M., Ju, Y. C., Ko, S. W., Yoon, H. S., and Kang, G. H., Analytical Study of the Electrical Output Characteristics of c-Si Solar Cells by Cut and Shading Phenomena, Energies, Vol. 11, No. 12, pp. 3397, 2018. 10.3390/en11123397
Jee, H. S., Lee, S. H., Jeong, C. H., and Lee, J. H., Electrically Conductive Adhesives and the Shingled Array Cell for High Density Modules, Journal of Nanoscience and Nanotechnology, Vol. 19, pp. 1360-1363, 2019. 10.1166/jnn.2019.1620030469188
Park, J., Oh, W., Park, H., Jeong, C., Choi, B., and Lee, J., Analysis of Solar Cells Interconnected by Electrically Conductive Adhesives for High-density Photovoltaic Modules, Applied Surface Science, Vol. 484, pp. 732-739, 2019. 10.1016/j.apsusc.2019.03.307
  • Publisher :Korean Solar Energy Society
  • Publisher(Ko) :한국태양에너지학회
  • Journal Title :Journal of the Korean Solar Energy Society
  • Journal Title(Ko) :한국태양에너지학회 논문집
  • Volume : 41
  • No :2
  • Pages :63-71
  • Received Date :2021. 04. 07
  • Revised Date :2021. 04. 24
  • Accepted Date : 2021. 04. 26