All Issue

2022 Vol.42, Issue 6 Preview Page

Research Article

30 December 2022. pp. 127-136
Abstract
References
1
United Nations, For a Livable Climate: Net-zero Commitments Must Be Backed by Credible Action, 2022. https://www.un.org/en/climatechange/net-zero-coalition last accessed on the 2nd August 2022.
2
Cheon, Y., Review of Global Carbon Neutral Strategies and Technologies, Journal of The Korean Society of Mineral and Energy Resources Engineers, Vol. 59, No. 1, pp. 99-112, 2022, https://doi.org/10.32390/ksmer.2022.59.1.099 10.32390/ksmer.2022.59.1.099
3
Han, S.-G., Noh, Y.-S., Hyon, B.-J., Park, J.-S., and Joo, D., Development of a 3 kW Grid-tied PV Inverter with GaN HEMT Considering Thermal Considerations, The Transactions of the Korean Institute of Power Electronics, Vol. 26, No. 5, pp. 325-333, 2021, https://doi.org/10.6113/TKPE.2021.26.5.325 10.6113/TKPE.2021.26.5.325
4
Mun, J.-G., Trends and Hereafter Forecast on Domestic and Foreign GaN Power Device Developments, Ceramist, Vol. 16, No. 4, pp. 53-66, 2013.
5
Lee, H.-H., Jung, D.-H., Oh, S.-J., and Jung, J.-P., High Technology and Latest Trends of WBG Power Semiconductors, Journal of the Microelectronics and Packaging Society, Vol. 25, No. 4, pp. 17-23, 2018, https://doi.org/10.6117/kmeps.2018.25.4.017 10.6117/kmeps.2018.25.4.017
6
Kim, M. J., Kim, J., and Lee, C. H., An Analytical Study for Improving the Heat Dissipation Efficiency of GaN Device, Proceedings of KSPE 2016 Autumn Conference, pp. 40-41, October 2016, Yeosu, Republic of Korea.
7
Lee, S.-I., Lee, S.-M., and Park, D.-H., Analysis of Thermal Properties in LED Package by via Hole of FR4 PCB, Journal of the Korean Institute of Illuminating and Electrical Installation Engineers, Vol. 24, No. 12, pp. 57-63, 2010, https://doi.org/10.5207/JIEIE.2010.24.12.057 10.5207/JIEIE.2010.24.12.057
8
Yoon, P. Y., Tak, A. R., Lee, S. K., and Lee, J., Analysis of Thermal via Hole Effect on FR4 PCB in Avionics using Numerical Simulation, Proceedings of KSPE 2016 Autumn Conference, pp. 245-246, October 2016, Yeosu, Republic of Korea.
9
Jeong, H., Kim, K. Y., and Lee, H. M., Research of Cap Plate via Hole PCB for Automotive LED Lamp, KSAE 2019 Annual Spring Conference, pp. 643-644, May 2019, Jeju, Republic of Korea.
10
Kim, N., Kwak, B., Kim, M., Cha, D. A., and Jeong, H. J., Numerical Study on Heat Dissipation Characteristics of PCB Respect to Heatsink Shape, Proceedings of KSME 2021 Thermal Engineering Division Spring Conference, pp. 214-215, May 2021, Jeju, Republic of Korea.
11
Jeong, H. J., Kwak, B., Kim, M., and Cha, D. A., Numerical Study on Heat Dissipation Characteristics by Heatsink Structure of PCB, pp. 1324-1325, Proceedings of KSME 2021 Annual Conference, November 2021, Gwangju, Republic of Korea.
12
Santillo, R., Intro to Transient Thermal Analysis, https://courses.ansys.com/wp-content/uploads/2020/05/Lesson-1-Introduction-to-transient-analysis.pdf last accessed on the 11th August 2022.
13
Kim, S-K., Yang, J-W., Choi, Y-H., Kim, K-Y., and Han, S-K., High Heat Dissipation and High Power Density Modular Buck Converter Based GaN-FET, Proceedings of Power Electronics Conference, pp. 96-97, March 2017, Tampa, FL, U.S.A.
Information
  • Publisher :Korean Solar Energy Society
  • Publisher(Ko) :한국태양에너지학회
  • Journal Title :Journal of the Korean Solar Energy Society
  • Journal Title(Ko) :한국태양에너지학회 논문집
  • Volume : 42
  • No :6
  • Pages :127-136
  • Received Date :2022. 08. 24
  • Revised Date :2022. 10. 24
  • Accepted Date : 2022. 11. 28