Evaluation of Thermal Stability of Electrically Conductive Adhesives for Flexible Thin-Film Solar Cells

Dajeong Kim; Jincheol Kim; Nochang Park

doi:10.7836/kses.2021.41.6.031

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2021 Vol.41, Issue 6 Preview Page Next Page

Research Article

Evaluation of Thermal Stability of Electrically Conductive Adhesives for Flexible Thin-Film Solar Cells 유연 박막 태양전지에 적용하기 위한 전기 전도성 접착제의 열 안정성 평가

30 December 2021. pp. 31-37

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Abstract

In recent years, pre-cut thin strips of solar cells have been assembled into gapless solar modules in a shingle-like manner, one on top of the other. This technique is called shingling technology, and is gaining increasing market attention. In particular, efficient packing that leaves no space between cells is preferred since it yields an economic gain. One of the biggest market opportunities is the use of electrically conductive adhesives (ECA), which act as a glue between pre-cut cells. Although there are many studies on ECA with a silicon solar cell area, research needs to be expanded in the area of a flexible solar cell that is more sensitive to heat stress. This study explores two types of silver-based ECA materials. The curing time varied from 30 to 60 s, and the curing temperature from 130 to 170°C. The assembled flexible solar cells were evaluated using temperature cycling tests.

Keywords

Electrically Conductive Adhesives

Solar Cells

Flexible

Efficiency

Temperature Cycling Test

키워드

전도성접착제

태양전지

유연

효율

온도사이클시험

References

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Jee, H. S., Moon, D. H., Song, J. H., and Jeong, C. H., Shingled String for the High Performance Photovoltaic Module, Current Photovoltaic Research, Vol. 6, No. 4, pp. 119-123, 2018.

Beaucarnen, G., Filipek, I. K., Campeol, F., Young, X., Wei, J., Yu, Y., Russell, R., and Duerinckx, F., Innovative Cell Interconnection Based on Ribbon Bonding of Busbarless Cells Using Silicone-based Electrically Conductive Adhesives, Energy Procedia, Vol. 67, pp. 185-193, 2015. 10.1016/j.egypro.2015.03.302

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Wang, X. Q., Gan, W. P., Xiang, F., and Li, B. Y., Effect of Curing Agent and Curing Substrate on Low Temperature Curable Silver Conductive Adhesive, Journal of Materials Science: Materials in Electronics, Vol. 30, No. 3, pp. 2829-2836, 2019. 10.1007/s10854-018-0559-y

Information

Publisher :Korean Solar Energy Society
Publisher(Ko) :한국태양에너지학회
Journal Title :Journal of the Korean Solar Energy Society
Journal Title(Ko) :한국태양에너지학회 논문집
Volume : 41
No :6
Pages :31-37
Received Date : 2021-10-18
Revised Date : 2021-11-02
Accepted Date : 2021-11-05
DOI :https://doi.org/10.7836/kses.2021.41.6.031

Journal of the Korean Solar Energy Society ISSN:1598-6411(Print) 2508-3562(Online) 한국태양에너지학회 논문집

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